| Type | Consumer Electronics PCBA |
|---|---|
| Place Of Origin | Guangdong, China |
| Copper Thickness | 1 Oz |
| Base Material | FR4 |
| Board Thickness | 1.6mm |
| Type | Combining Rigid Circuit Board |
|---|---|
| Place Of Origin | Guangdong, China |
| Material | Fiberglass Epoxy |
| Base Material | FR4 (Tg130~Tg170) |
| Insulation Materials | Epoxy Resin |
| Type | Rigid Circuit Board |
|---|---|
| Place Of Origin | Guangdong, China |
| Material | Fiberglass Epoxy |
| Application | Medical Instruments |
| Base Material | FR4 (Tg130~Tg170) |
| Type | Ceramic PCB Manufacturer |
|---|---|
| Material | FR4 CEM1 CEM3 Hight TG |
| Base Material | Copper |
| Insulation Materials | Organic Resin |
| Processing Technology | Electrolytic Foil |
| Type | Consumer Electronics PCBA |
|---|---|
| Place Of Origin | Guangdong, China |
| Supplier Type | OEM PCBA |
| Material Type | FR4,High-TG,Halogen Free,Rogers,Aluminum Base |
| Base Material | FR4 |
| Place Of Origin | Guangdong, China |
|---|---|
| Base Material | Electroless Copper/rolling Copper |
| Copper Thickness 12~50UM | 12~50UM |
| Board Thickness | 0.075~0.16MM |
| Min. Hole Size | 0.2mm |
| Type | Consumer Electronics Pcba |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Material | FR4 CEM1 CEM3 Ceramic Aluminum |
| Copper Thickness | 1/2OZ 1OZ 2OZ 3OZ |
| Board Thickness | 0.2mm-4.5mm |
| Type | Rgid PCB |
|---|---|
| Surface Finishing | Immersion Gold/OSP |
| Base Material | PI |
| Copper Thickness | 1-6 OZ |
| Board Thickness | 0.2-0.5mm |
| Type | Rgid PCB |
|---|---|
| Surface Finishing | Immersion Gold/OSP |
| Base Material | PI |
| Copper Thickness | 1-6 OZ |
| Board Thickness | 0.2-0.5mm |
| Min. Hole Size | 0.2mm |
|---|---|
| Min. Line Width/Space | 3mil/3mil |
| Product Type | Rigid Flex PCB Manufacturing |
| Surface Finish | HASL, ENIG, OSP, Immersion Silver, Immersion Tin |
| Board Size | Max. 600mm X 600mm |
