| Max. Aspect Ratio | 8:1 |
|---|---|
| Min. Silkscreen Line Width/Space | 2.5/2.5mil |
| Min. Hole Size | 0.2mm |
| Min. Annular Ring | 3mil |
| Copper Thickness | 2-6oz |
| Min. Solder Mask Dam | 3mil |
|---|---|
| Min. Annular Ring | 3mil |
| Min. Edge Clearance | 3mil |
| Board Thickness | 1.6-3.2mm |
| Min. Solder Mask Bridge | 3mil |
| Min. Solder Mask Dam | 3mil |
|---|---|
| Min. Annular Ring | 3mil |
| Min. Edge Clearance | 3mil |
| Board Thickness | 1.6-3.2mm |
| Min. Solder Mask Bridge | 3mil |
| Model Number | Multilayer Pcba |
|---|---|
| Type | Consumer Electronics Pcba |
| Brand Name | OEM |
| Supplier Type | Multilayer Pcba Manufacture |
| Copper Thickness | 1 Oz |
| Place Of Origin | Guangdong, China |
|---|---|
| Type | Multilayer PCB |
| Number Of Layers | 1- 24 Layers |
| Base Material | FR-4 |
| Copper Thickness | 1oz |
| Type | Rigid Circuit Board |
|---|---|
| Place Of Origin | Guangdong, China |
| Dielectric | FR-4 |
| Material | Fiberglass Epoxy |
| Application | Consumer Electronics |
| Type | Ceramic PCB Manufacturer |
|---|---|
| Material | FR4 CEM1 CEM3 Hight TG |
| Base Material | Copper |
| Insulation Materials | Organic Resin |
| Processing Technology | Electrolytic Foil |
| Base Material | FR4 CEM1 CEM3 Ceramic Aluminum |
|---|---|
| Min. Line Spacing | 0.1mm/4mil |
| Min. Hole Size | 0.1mm-1mm |
| Surface Finishing | HASL,Gold Plating |
| Product Name | Electronic Boards |
| Origin | Guangdong, China |
|---|---|
| Base Material | Copper |
| Material | Epoxide Woven Glass Fabric Laminate |
| Structure | Multilayer Rigid PCB |
| Application | Electronics Device |
| Material | FR4 CEM1 CEM3 Hight TG |
|---|---|
| Base Material | FR-4 |
| Copper Thickness | 1/2 Oz Min; 12 Oz Max |
| Board Thickness | 0.2mm-6mm(8mil-126mil) |
| Min. Hole Size | 0.20mm |
