| Copper Thickness | 1/2OZ 1OZ 2OZ 3OZ |
|---|---|
| Base Material | CEM-1 OR FR-4 |
| Min. Line Spacing | 0.1mm4mil) |
| Board Thickness | 0.5~3.2mm |
| Min. Line Width | 0.1mm/4mi |
| Model Number | OEM/ODM/EMS |
|---|---|
| Base Material | FR-4/High TG FR-4/CEM-3/CEM-1 |
| Copper Thickness | 0.5-4 Oz |
| Board Thickness | 1.6mm |
| Min. Hole Size | 0.1mm |
| Copper Thickness | 1oz |
|---|---|
| Base Material | FR-4 |
| Min. Line Spacing | 0.1mm4mil) |
| Board Thickness | 1.6mm-3.2mm |
| Min. Line Width | 0.2mm |
| Type | Consumer Electronics PCBA |
|---|---|
| Place Of Origin | Guangdong, China |
| Supplier Type | OEM PCBA |
| Copper Thickness | 1 Oz |
| Min. Hole Size | 0.075 Mm |
| Type | Rigid Circuit Board |
|---|---|
| Place Of Origin | Guangdong, China |
| Dielectric | FR-4 |
| Material | Fiberglass Epoxy |
| Application | Consumer Electronics |
| Base Material | FR4 (Tg130~Tg170) |
|---|---|
| Insulation Materials | Organic Resin |
| Board Material | Fr4 And Polyimide |
| Layers | 1-40 Layers |
| Board Thickness | 1.6mm |
| Type | FPC |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Material | FR4,Aluminum,High Tg FR4 |
| Copper Thickness | 0.5-1oz |
| Board Thickness | 0.4-4.0mm |
| Model NO. | Rigid-Flex Board |
|---|---|
| Surface Finish | HASL, Gold Finger, OSP, Enig, Peelable Mask |
| Insulation Materials | Epoxy Resin |
| PCB Type | Rigid PCB, Flex PCB, Rigid-Flex PCB |
| Service | PCB, PCBA, SMT, Components |
| Type | Consumer Electronics PCBA |
|---|---|
| Place Of Origin | Guangdong, China |
| Copper Thickness | 1 Oz |
| Base Material | FR4 |
| Board Thickness | 1.6mm |
| Type | Combining Rigid Circuit Board |
|---|---|
| Place Of Origin | Guangdong, China |
| Material | Fiberglass Epoxy |
| Base Material | FR4 (Tg130~Tg170) |
| Insulation Materials | Epoxy Resin |
