Base Material | FR4 (Tg130~Tg170) |
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Insulation Materials | Organic Resin |
Board Material | Fr4 And Polyimide |
Layers | 1-40 Layers |
Board Thickness | 1.6mm |
Type | Rigid Circuit Board |
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Place Of Origin | Guangdong, China |
Base Material | FR4, Aluminum , CEM, PI |
Copper Thickness | 1 Oz |
Board Thickness | 1.6mm |
Type | FPC |
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Place Of Origin | Guangdong, China |
Base Material | FR4,Aluminum,High Tg FR4 |
Copper Thickness | 0.5-1oz |
Board Thickness | 0.4-4.0mm |
Model NO. | Rigid-Flex Board |
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Dielectric | FR-4 |
Material | Fiberglass Epoxy |
Mechanical Rigid | Rigid |
Layer | 1-40 Layer |
Place Of Origin | Guangdong, China |
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Insulation Materials | Epoxy Resin |
Stiffener Material | Pi |
Copper Thickness For Inner Layers | 20 Oz |
Surface Finishing | ENIG,HASL,OSP,ENEPIG,Flash Gold |
Model Number | Flexible Board |
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Place Of Origin | Guangdong, China |
Base Material | PI, FR4/PI/Custom |
Copper Thickness | 0.5-2oz |
Board Thickness | 0.1-0.5mm |
Model Number | Customized |
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Place Of Origin | Guangdong, China |
Base Material | PI |
Copper Thickness | 0.5OZ-2oz |
Board Thickness | 1.0mm |
Ntegration | GSIC |
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Technics | Thin Film IC |
Trademark | OEM |
Base Material | FR-4/aluminum/ceramic/cem-3/FR-1 |
Min. Line Spacing | 0.2mm |
Place Of Origin | Guangdong, China |
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Model Number | Customized |
Base Material | FR4 CEM1 CEM3 Ceramic Aluminum |
Copper Thickness | 1/2OZ 1OZ 2OZ 3OZ |
Board Thickness | 0.2mm~3.0mm |
Type | Heavy Copper PCB |
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Place Of Origin | Guangdong, China |
Brand Name | OEM/ODM |
Base Material | FR4 |
Copper Thickness | 0.5-5 OZ |