| Application | Electronics Device |
|---|---|
| Function | PCBA Board Service Prototype PCB Assembly |
| Base Material | FR-4 |
| Surface Finishing | HASL,HASL Lead Free |
| Solder Mask | Green. Red. Blue. White. Black.Yellow |
| Copper Thickness | 1/2OZ 1OZ 2OZ 3OZ |
|---|---|
| Base Material | CEM-1 OR FR-4 |
| Min. Line Spacing | 0.1mm4mil) |
| Board Thickness | 0.5~3.2mm |
| Min. Line Width | 0.1mm/4mi |
| Type | Motherboard PCBA |
|---|---|
| Place Of Origin | Guangdong, China |
| Copper Thickness | 3 Oz |
| Board Material | Fr4 And Polyimide |
| Surface | OSP,Immersion Gold,Hal Lead Free,Hal |
| Type | Rigid Circuit Board |
|---|---|
| Dielectric | FR-4 |
| Material | Fiberglass Epoxy |
| Base Material | Copper |
| Insulation Materials | Organic Resin |
| Place Of Origin | Guangdong, China |
|---|---|
| Type | Multilayer PCB |
| Number Of Layers | 1- 24 Layers |
| Base Material | FR-4 |
| Copper Thickness | 1oz |
| Place Of Origin | Guangdong, China |
|---|---|
| Type | Multilayer PCB |
| Number Of Layers | 1- 24 Layers |
| Base Material | FR-4 |
| Copper Thickness | 1oz |
| Type | HID PCB |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Material | Polyimide/polyester |
| Copper Thickness | 1oz / 1/2 O Z/ 1/3 Oz, 1OZ |
| Board Thickness | 0.2mm~3.0mm |
| Model NO. | Rigid-Flex Board |
|---|---|
| Processing Technology | Electrolytic Foil |
| Base Material | Copper |
| Insulation Materials | Epoxy Resin |
| Surface Treatment | Immersion Silver, Tin, Gold/OSP/Has |
| Type | Ceramic PCB |
|---|---|
| Place Of Origin | Guangdong, China |
| Material | FR4/CEM-1/CEM-3/FR1/aluminum |
| Base Material | FR4/aluminum/ceramic |
| Copper Thickness | 1oz |
| Model Number | Customized |
|---|---|
| Type | Consumer Electronics PCBA |
| Place Of Origin | Guangdong, China |
| Supplier Type | OEM PCBA |
| MOQ | 1PCS |
