| Model NO. | Rigid-Flex Board |
|---|---|
| Processing Technology | Electrolytic Foil |
| Base Material | Copper |
| Insulation Materials | Epoxy Resin |
| Surface Treatment | Immersion Silver, Tin, Gold/OSP/Has |
| Type | Rigid Circuit Board |
|---|---|
| Processing Technology | Electrolytic Foil |
| Base Material | FR-4 |
| Surface Finishing | HASL Lead Free |
| Copper Thickness | 1oz |
| Type | Rigid Circuit Board |
|---|---|
| Origin | Guangdong, China |
| Base Material | Fr-4 |
| Insulation Materials | Organic Resin |
| Surface | OSP,Immersion Gold,Hal Lead Free,Hal |
| Type | Consumer Electronics Pcba |
|---|---|
| Supplier Type | PCB,PCBA,FPC,HDI,RFPC |
| Silkscreen Color | Black, White, Red, Green |
| Material | FR4 CEM1 CEM3 Hight TG |
| Service | One-stop Turnkey Service |
| Metal Coating | Copper |
|---|---|
| Mode Of Production | SMT |
| Copper Thickness | 1 Oz |
| Min. Hole Size | 0.15mm--0.25mm |
| Min. Line Width | 0.063mm |
| Type | Rigid Circuit Board |
|---|---|
| Origin | Guangdong, China |
| Base Material | Copper |
| Insulation Materials | Metal Composite Materials |
| Min Hole Size | 0.1mm (4 Mil) |
| Model Number | OEM/ODM/EMS |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Material | FR-4 |
| Surface Finishing | HASL Lead Free |
| Layer | 1-40 Layer |
| Application | Electronics Device |
|---|---|
| Function | PCBA Board Service Prototype PCB Assembly |
| Base Material | FR-4 |
| Surface Finishing | HASL,HASL Lead Free |
| Solder Mask | Green. Red. Blue. White. Black.Yellow |
| Type | Rgid PCB |
|---|---|
| Surface Finishing | Immersion Gold/OSP |
| Base Material | PI |
| Copper Thickness | 1-6 OZ |
| Board Thickness | 0.2-0.5mm |
| Max. Aspect Ratio | 8:1 |
|---|---|
| Min. Silkscreen Line Width/Space | 2.5/2.5mil |
| Min. Hole Size | 0.2mm |
| Min. Annular Ring | 3mil |
| Copper Thickness | 2-6oz |
