| Application | Electronics Device |
|---|---|
| Function | PCBA Board Service Prototype PCB Assembly |
| Base Material | FR-4 |
| Surface Finishing | HASL,HASL Lead Free |
| Solder Mask | Green. Red. Blue. White. Black.Yellow |
| Origin | Guangdong, China |
|---|---|
| Metal Coating | Copper |
| Mode Of Production | SMT / DIP |
| Base Material | FR-4 |
| Layers | Multilayer |
| Place Of Origin | Guangdong, China |
|---|---|
| Type | Multilayer PCB |
| Number Of Layers | 1- 24 Layers |
| Base Material | FR-4 |
| Copper Thickness | 1oz |
| Model NO. | Rigid-Flex Board |
|---|---|
| Processing Technology | Electrolytic Foil |
| Base Material | Copper |
| Insulation Materials | Epoxy Resin |
| Surface Treatment | Immersion Silver, Tin, Gold/OSP/Has |
| Min. Edge Clearance | 3mil |
|---|---|
| Max. Aspect Ratio | 8:1 |
| Min. Solder Mask Dam | 3mil |
| Board Thickness | 1.6-3.2mm |
| Min. Annular Ring | 3mil |
| Layer | 1-40 Layer |
|---|---|
| Packaging Details | Foam+Anti-static bags+cartons |
| Delivery Time | 2-3 working days |
| Payment Terms | L/C, D/A, D/P, T/T, Western Union, MoneyGram |
| Supply Ability | 30000 Square Meter/Square Meters per Month module electronic board |
| Type | Rgid PCB |
|---|---|
| Surface Finishing | Immersion Gold/OSP |
| Base Material | PI |
| Copper Thickness | 1-6 OZ |
| Board Thickness | 0.2-0.5mm |
| Max. Aspect Ratio | 8:1 |
|---|---|
| Min. Silkscreen Line Width/Space | 2.5/2.5mil |
| Min. Hole Size | 0.2mm |
| Min. Annular Ring | 3mil |
| Copper Thickness | 2-6oz |
| Type | PCB Assembly, 94V0 Electronic |
|---|---|
| Place Of Origin | Guangdong, China |
| Supplier Type | OEM PCBA |
| Material | FR4 CEM1 CEM3 Hight TG |
| Base Material | FR4 |
| Type | Rigid Circuit Board |
|---|---|
| Origin | Guangdong, China |
| Base Material | Copper |
| Material | Complex |
| Insulation Materials | Organic Resin |
