| Processing Technology | Electrolytic Foil |
|---|---|
| Insulation Materials | Epoxy Resin |
| Min Line Spacing | 0.1mm(4mil) |
| Solder Mask | Green, White, Black, Blue, Red(Customized) |
| Board Thickness | 0.2mm-6mm |
| Model Number | OEM/ODM/EMS |
|---|---|
| Base Material | FR-4 |
| Copper Thickness | 0.5-6oz |
| Board Thickness | 0.2-4mm |
| Min. Hole Size | 0.1mm |
| Base Material | FR4 |
|---|---|
| Application | Electronics Device |
| Number Of Layers | 1- 40 Layers |
| Solder Mask | Green/Red/Yellow/Blue/White/Black ETC |
| PCB QC | Electrical Testing,Flying Probe Tester |
| Type | Consumer Electronics Pcba |
|---|---|
| Copper Thickness | 2 OZ, 1/3oz ~6oz |
| Min. Hole Size | 0.1mm (4mil) |
| Min. Line Spacing | 1/2 Oz. Copper |
| Base Material | FR-4 |
| Place Of Origin | Guangdong, China |
|---|---|
| Supplier Type | OEM PCBA |
| Copper Thickness | 0.5-6oz |
| Application | Electronics Device |
| Material | FR4 CEM1 CEM3 Hight TG |
| Base Material | FR4 CEM1 CEM3 Ceramic Aluminum |
|---|---|
| Min. Line Spacing | 0.1mm/4mil |
| Min. Hole Size | 0.1mm-1mm |
| Surface Finishing | HASL,Gold Plating |
| Product Name | Electronic Boards |
| Surface Treatment | HASL |
|---|---|
| PCB Thickness | 1.6mm |
| Copper Thickness | 1oz |
| Silkscreen Color | White |
| Min Hole Size | 0.2mm |
| Model Number | FLCA-G125 |
|---|---|
| Type | FPC |
| Processing Technology | Electrolytic Foil |
| Base Material | Copper |
| Insulation Materials | Organic Resin |
| Material | FR4 CEM1 CEM3 Hight TG |
|---|---|
| Base Material | FR-4 |
| Copper Thickness | 1/2 Oz Min; 12 Oz Max |
| Board Thickness | 0.2mm-6mm(8mil-126mil) |
| Min. Hole Size | 0.20mm |
| Type | Rigid Circuit Board |
|---|---|
| Flame Retardant Properties | 94V0 |
| PCB Layers | 1-40 Layers |
| Brand Material | OAK, 3M, Omega |
| Copper Thickness | 0.5-20OZ |
