| Base Material | FR4 CEM1 CEM3 Ceramic Aluminum |
|---|---|
| Min. Line Spacing | 0.1mm/4mil |
| Min. Hole Size | 0.1mm-1mm |
| Surface Finishing | HASL,Gold Plating |
| Product Name | Electronic Boards |
| Ntegration | GSIC |
|---|---|
| Technics | Thin Film IC |
| Trademark | OEM |
| Base Material | FR-4/aluminum/ceramic/cem-3/FR-1 |
| Min. Line Spacing | 0.2mm |
| Place Of Origin | Guangdong, China |
|---|---|
| Copper Thickness | 1 Oz |
| Base Material | Polyimide |
| Min. Line Width | 0.1mm |
| Board Thickness | 1.6mm |
| Type | Rigid Circuit Board |
|---|---|
| Origin | Guangdong, China |
| Base Material | Copper |
| Insulation Materials | Metal Composite Materials |
| Min Hole Size | 0.1mm (4 Mil) |
| Type | Consumer Electronics PCBA |
|---|---|
| Place Of Origin | Guangdong, China |
| Supplier Type | OEM PCBA |
| Material Type | FR4,High-TG,Halogen Free,Rogers,Aluminum Base |
| Base Material | FR4 |
| Model Number | FLCA-G125 |
|---|---|
| Type | FPC |
| Processing Technology | Electrolytic Foil |
| Base Material | Copper |
| Insulation Materials | Organic Resin |
| Type | Rigid Circuit Board |
|---|---|
| Place Of Origin | Guangdong, China |
| Dielectric | FR-4 |
| Material | Fiberglass Epoxy |
| Application | Consumer Electronics |
| PCB Material | FR4 |
|---|---|
| Lead Time | 7-10 Days |
| Product Name | PCB Circuit Board Assembly |
| Surface Treatment | HASL |
| PCB Layer | 2-Layer |
| Copper Thickness | 1oz |
|---|---|
| Min Line Spacing | 0.1mm |
| Min Hole Size | 0.2mm |
| Packaging | Vacuum Package |
| Surface Treatment | HASL |
| Packaging | Vacuum Package |
|---|---|
| Copper Thickness | 1oz |
| Surface Treatment | HASL |
| Min Hole Size | 0.2mm |
| Min Line Spacing | 0.1mm |
