| Copper Thickness | 0.5-3.0 Oz |
|---|---|
| Min. Line Width | 0.1 0mm |
| Base Material | FR-4/aluminum /cem-3/FR-1 |
| Min. Line Spacing | 0.1mm4mil) |
| Board Thickness | 1.6mm-3.2mm |
| Origin | Guangdong, China |
|---|---|
| Metal Coating | Copper |
| Mode Of Production | SMT / DIP |
| Base Material | FR-4 |
| Layers | Multilayer |
| Base Material | FPC |
|---|---|
| Board Material | Polyimide |
| Board Thickness | 1.6 Mm |
| Copper Thickness | 1 Oz (35um) |
| Surface Treatment | HASL Lead Free |
| Type | Motherboard PCBA |
|---|---|
| Place Of Origin | Guangdong, China |
| Copper Thickness | 3 Oz |
| Board Material | Fr4 And Polyimide |
| Surface | OSP,Immersion Gold,Hal Lead Free,Hal |
| Type | Rigid Circuit Board |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Material | FR4, Aluminum , CEM, PI |
| Copper Thickness | 1 Oz |
| Board Thickness | 1.6mm |
| Type | FPC |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Material | FR4,Aluminum,High Tg FR4 |
| Copper Thickness | 0.5-1oz |
| Board Thickness | 0.4-4.0mm |
| Model NO. | Rigid-Flex Board |
|---|---|
| Surface Finish | HASL, Gold Finger, OSP, Enig, Peelable Mask |
| Insulation Materials | Epoxy Resin |
| PCB Type | Rigid PCB, Flex PCB, Rigid-Flex PCB |
| Service | PCB, PCBA, SMT, Components |
| Place Of Origin | Guangdong, China |
|---|---|
| Insulation Materials | Epoxy Resin |
| Stiffener Material | Pi |
| Copper Thickness For Inner Layers | 20 Oz |
| Surface Finishing | ENIG,HASL,OSP,ENEPIG,Flash Gold |
| Model NO. | Rigid-Flex Board |
|---|---|
| Processing Technology | Electrolytic Foil |
| Base Material | Copper |
| Insulation Materials | Epoxy Resin |
| Surface Treatment | Immersion Silver, Tin, Gold/OSP/Has |
| Type | Flexible Circuit Board |
|---|---|
| Place Of Origin | Guangdong, China |
| Supplier Type | Factory/Manufacturer |
| Copper Thickness | 1 Oz |
| Service | One-Stop FPC Assembly |
