| Type | Ceramic PCB Manufacturer |
|---|---|
| Material | FR4 CEM1 CEM3 Hight TG |
| Base Material | Copper |
| Insulation Materials | Organic Resin |
| Processing Technology | Electrolytic Foil |
| Type | Ceramic PCB Manufacturer |
|---|---|
| Material | FR4 CEM1 CEM3 Hight TG |
| Base Material | Copper |
| Insulation Materials | Organic Resin |
| Processing Technology | Electrolytic Foil |
| Packaging | Vacuum Package |
|---|---|
| Min Hole Size | 0.2mm |
| Surface Treatment | HASL |
| Shipping Method | DHL,UPS,FedEx |
| Product Name | PCB Circuit Board Assembly |
| Type | Consumer Electronics Pcba |
|---|---|
| Min Line Width | 0.1mm |
| Solder Mask Color | Green |
| Product Name | PCB Circuit Board Assembly |
| Copper Thickness | 1oz |
| Shipping Method | DHL,UPS,FedEx |
|---|---|
| Solder Mask Color | Green |
| PCB Layer | 2-Layer |
| Surface Treatment | HASL |
| Packaging | Vacuum Package |
| Material Type | FR-4, High Tg FR-4, Halogen Free, Rogers, Arlon |
|---|---|
| Impedance Control | ±10% |
| Product Name | HDI PCB Manufacturing |
| Min. Hole Size | 0.2mm |
| Board Thickness | 0.2-3.2mm |
| Processing Technology | Electrolytic Foil |
|---|---|
| Insulation Materials | Epoxy Resin |
| Min Line Spacing | 0.1mm(4mil) |
| Solder Mask | Green, White, Black, Blue, Red(Customized) |
| Board Thickness | 0.2mm-6mm |
| Type | Consumer Electronics Pcba |
|---|---|
| Copper Thickness | 2 OZ, 1/3oz ~6oz |
| Min. Hole Size | 0.1mm (4mil) |
| Min. Line Spacing | 1/2 Oz. Copper |
| Base Material | FR-4 |
| Place Of Origin | Guangdong, China |
|---|---|
| Base Material | Aluminum |
| Insulation Materials | Epoxy Resin |
| Layer | 1-40 Layer |
| Board Thickness | 0.2-8.0mm |
| PCB Material | FR4 |
|---|---|
| Lead Time | 7-10 Days |
| Product Name | PCB Circuit Board Assembly |
| Surface Treatment | HASL |
| PCB Layer | 2-Layer |
