| Type | Rigid Circuit Board |
|---|---|
| Origin | Guangdong, China |
| Mechanical Rigid | Rigid |
| Material | Fiberglass Epoxy |
| Board Material | Fr4, H-Tg, It-180A, Cem, Aluminum, Copper Base |
| Type | Consumer Electronics Pcba |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Material | FR4 CEM1 CEM3 Ceramic Aluminum |
| Copper Thickness | 1/2OZ 1OZ 2OZ 3OZ |
| Board Thickness | 0.2mm-4.5mm |
| Place Of Origin | Guangdong, China |
|---|---|
| Supplier Type | OEM PCBA |
| Copper Thickness | 0.5-6oz |
| Application | Electronics Device |
| Material | FR4 CEM1 CEM3 Hight TG |
| Type | Consumer Electronics PCBA |
|---|---|
| Place Of Origin | Guangdong, China |
| Supplier Type | OEM |
| Product Name | FPC |
| Quality Assurance | AOI IQC PQC QA |
| Type | Ceramic PCB Manufacturer |
|---|---|
| Material | FR4 CEM1 CEM3 Hight TG |
| Base Material | Copper |
| Insulation Materials | Organic Resin |
| Processing Technology | Electrolytic Foil |
| Type | Ceramic PCB Manufacturer |
|---|---|
| Material | FR4 CEM1 CEM3 Hight TG |
| Base Material | Copper |
| Insulation Materials | Organic Resin |
| Processing Technology | Electrolytic Foil |
| Type | Rigid Circuit Board |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Materia | FR-4 |
| Insulation Materials | Organic Resin |
| Surface | OSP,Immersion Gold,Hal Lead Free,Hal |
| Base Material | FR4 CEM1 CEM3 Ceramic Aluminum |
|---|---|
| Min. Line Spacing | 0.1mm/4mil |
| Min. Hole Size | 0.1mm-1mm |
| Surface Finishing | HASL,Gold Plating |
| Product Name | Electronic Boards |
| Type | Consumer Electronics PCBA |
|---|---|
| Place Of Origin | Guangdong, China |
| Supplier Type | OEM PCBA |
| Material Type | FR4,High-TG,Halogen Free,Rogers,Aluminum Base |
| Base Material | FR4 |
| Type | Consumer Electronics Pcba |
|---|---|
| Brand Name | Customization |
| Copper Thickness | 2 OZ, 1/3oz ~6oz |
| Min. Hole Size | 0.1mm (4mil) |
| Min. Line Spacing | 1/2 Oz. Copper |
