| Type | Rigid Circuit Board |
|---|---|
| Base Material | Copper |
| Base Material | FR-4 |
| Layer | 1-40 Layer |
| Solder Mask | Green/Blue/Red |
| Type | Rigid Circuit Board |
|---|---|
| Base Material | Copper |
| Base Material | FR-4 |
| Board Thickness | 0.4-3.2mm |
| Solder Mask | Green/Blue/Red |
| Min Line Width | 0.1mm |
|---|---|
| Product Name | PCB Circuit Board Assembly |
| Surface Treatment | HASL |
| Min Line Spacing | 0.1mm |
| PCB Layer | 2-Layer |
| Silkscreen Color | White |
|---|---|
| Min Line Width | 0.1mm |
| Shipping Method | DHL,UPS,FedEx |
| Lead Time | 7-10 Days |
| PCB Thickness | 1.6mm |
| Surface Treatment | HASL |
|---|---|
| Product Name | PCB Circuit Board Assembly |
| Min Hole Size | 0.2mm |
| Solder Mask Color | Green |
| Copper Thickness | 1oz |
| Surface Treatment | HASL |
|---|---|
| Product Name | PCB Circuit Board Assembly |
| Min Hole Size | 0.2mm |
| Solder Mask Color | Green |
| Copper Thickness | 1oz |
| Model Number | OEM/ODM/EMS |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Material | FR-4 |
| Surface Finishing | HASL Lead Free |
| Layer | 1-40 Layer |
| Base Material | FR4 CEM1 CEM3 Ceramic Aluminum |
|---|---|
| Min. Line Spacing | 0.1mm/4mil |
| Min. Hole Size | 0.1mm-1mm |
| Surface Finishing | HASL,Gold Plating |
| Product Name | Electronic Boards |
| Processing Technology | Electrolytic Foil |
|---|---|
| Insulation Materials | Epoxy Resin |
| Min Line Spacing | 0.1mm(4mil) |
| Solder Mask | Green, White, Black, Blue, Red(Customized) |
| Board Thickness | 0.2mm-6mm |
| Material | FR4 CEM1 CEM3 Hight TG |
|---|---|
| Base Material | FR-4 |
| Copper Thickness | 1/2 Oz Min; 12 Oz Max |
| Board Thickness | 0.2mm-6mm(8mil-126mil) |
| Min. Hole Size | 0.20mm |
