| Base Material | FR4 (Tg130~Tg170) |
|---|---|
| Insulation Materials | Organic Resin |
| Board Material | Fr4 And Polyimide |
| Layers | 1-40 Layers |
| Board Thickness | 1.6mm |
| Type | Rigid Circuit Board |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Material | FR4, Aluminum , CEM, PI |
| Copper Thickness | 1 Oz |
| Board Thickness | 1.6mm |
| Type | FPC |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Material | FR4,Aluminum,High Tg FR4 |
| Copper Thickness | 0.5-1oz |
| Board Thickness | 0.4-4.0mm |
| Model NO. | Rigid-Flex Board |
|---|---|
| Dielectric | FR-4 |
| Material | Fiberglass Epoxy |
| Mechanical Rigid | Rigid |
| Layer | 1-40 Layer |
| Place Of Origin | Guangdong, China |
|---|---|
| Insulation Materials | Epoxy Resin |
| Stiffener Material | Pi |
| Copper Thickness For Inner Layers | 20 Oz |
| Surface Finishing | ENIG,HASL,OSP,ENEPIG,Flash Gold |
| Model Number | Flexible Board |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Material | PI, FR4/PI/Custom |
| Copper Thickness | 0.5-2oz |
| Board Thickness | 0.1-0.5mm |
| Model Number | Customized |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Material | PI |
| Copper Thickness | 0.5OZ-2oz |
| Board Thickness | 1.0mm |
| Ntegration | GSIC |
|---|---|
| Technics | Thin Film IC |
| Trademark | OEM |
| Base Material | FR-4/aluminum/ceramic/cem-3/FR-1 |
| Min. Line Spacing | 0.2mm |
| Place Of Origin | Guangdong, China |
|---|---|
| Model Number | Customized |
| Base Material | FR4 CEM1 CEM3 Ceramic Aluminum |
| Copper Thickness | 1/2OZ 1OZ 2OZ 3OZ |
| Board Thickness | 0.2mm~3.0mm |
| Type | Heavy Copper PCB |
|---|---|
| Place Of Origin | Guangdong, China |
| Brand Name | OEM/ODM |
| Base Material | FR4 |
| Copper Thickness | 0.5-5 OZ |
