| Model NO. | Rigid-Flex Board |
|---|---|
| Processing Technology | Electrolytic Foil |
| Base Material | Copper |
| Insulation Materials | Epoxy Resin |
| Surface Treatment | Immersion Silver, Tin, Gold/OSP/Has |
| Type | Consumer Electronics PCBA |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Material | Aluminum |
| Copper Thickness | 3u |
| Board Thickness | 0.2mm~3.0mm |
| Type | Ceramic PCB Manufacturer |
|---|---|
| Material | FR4 CEM1 CEM3 Hight TG |
| Base Material | Copper |
| Insulation Materials | Organic Resin |
| Processing Technology | Electrolytic Foil |
| Typy | Ceramic PCB , Customized |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Material | FR4,Rogers,Aluminum |
| Copper Thickness | 0.5oz-8oz |
| Board Thickness | 0.2mm-4mm |
| Type | Ceramic PCB Manufacturer |
|---|---|
| Material | FR4 CEM1 CEM3 Hight TG |
| Base Material | Copper |
| Insulation Materials | Organic Resin |
| Processing Technology | Electrolytic Foil |
| SSupplier Type | Wholesale |
|---|---|
| Origin | Guangdong, China |
| Copper Thickness | OEM |
| Material | Paper Phenolic Copper Foil Substrate |
| Base Material | Copper |
| Type | Rigid Circuit Board |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Material | FR4 |
| Surface Finishing | Lead Free HASL/ENIG/OSP |
| Board Thickness | 1.6mm |
| Type | Consumer Electronics Pcba |
|---|---|
| Brand Name | Customize |
| Surface Finishing | Lead-free HASL |
| Copper Thickness | 1oz |
| Solder Mask Color | Green Black Bule White |
| Type | Rgid PCB |
|---|---|
| Surface Finishing | Immersion Gold/OSP |
| Base Material | PI |
| Copper Thickness | 1-6 OZ |
| Board Thickness | 0.2-0.5mm |
| Board Thickness | 0.2mm-3.2mm |
|---|---|
| Max. Layer Count | 12-Layer |
| Copper Thickness | 1/2oz-5oz |
| Surface Finish | HASL, ENIG, OSP, Immersion Silver, Immersion Tin |
| Product Type | Rigid Flex PCB Manufacturing |
